Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications
Kazuo Kondo, Morihiro Kada, Kenji Takahashi (eds.)This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
Категорії:
Рік:
2015
Видання:
1
Видавництво:
Springer International Publishing
Мова:
english
ISBN 10:
3319186752
ISBN 13:
9783319186757
Файл:
PDF, 43.04 MB
IPFS:
,
english, 2015
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