3D Stacked Chips: From Emerging Processes to Heterogeneous...

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Technique - Electronics: VLSI
3D Stacked Chips: From Emerging...

3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

Name: 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
ISBN: 9783319204819

Ibrahim (Abe) M. Elfadel, Gerhard Fettweis (eds.)

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This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

Категорії:

Technique - Electronics: VLSI

Рік:

2016

Видання:

Видавництво:

Springer International Publishing

Мова:

english

Сторінки:

354

ISBN 10: